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IRS2453(1)D(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still a ir conditions.
Symbol
VB1,
VB2
VS1,
VS2
V HO1 ,
V HO2
V LO1 ,
V LO2
VRT
VCT
VSD
IRT
ICC
dV S /dt
PD
PD
R θ JA
R θ JA
TJ
TS
TL
Definition
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side output voltage
RT pin voltage
CT pin voltage
SD pin voltage
RT pin current
Supply current ( ? )
Allowable offset voltage slew rate
Maximum power dissipation @ T A ≤ +25 oC, 8-Pin DIP
Maximum power dissipation @ T A ≤ +25 oC, 8-Pin SOIC
Thermal resistance, junction to ambient, 8-Pin DIP
Thermal resistance, junction to ambient, 8-Pin SOIC
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
Min.
-0.3
VB - 25
VS - 0.3
-0.3
-0.3
-0.3
-0.3
-5
---
-50
---
---
---
---
-55
-55
---
Max.
625
VB + 0.3
VB + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
5
25
50
1.0
0.625
125
200
150
150
300
Units
V
mA
V/ns
W
oC/W
oC
?
This IC contains a zener clamp structure between the chip VCC and COM which has a nominal
breakdown voltage of 15.6 V. Please note that this supply pin should not be driven by a DC, low
impedance power source greater than the VCLAMP specified in the Electrical Characteristics section.
5
www.irf.com
? 2012 International Rectifier
November 28, 2012
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